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|Title: ||MEMS TECHNOLOGY|
|Authors: ||Arvind Kumar Jha|
|Issue Date: ||9-Feb-2011|
|Abstract: ||Micromechanical systems can be combined with
microelectronics, photonics or wireless capabilities new generation of
Microsystems can be developed which will offer far reaching
efficiency regarding space, accuracy, precision and so forth.
Micromechanical systems (MEMS) technology can be used fabricate
both application specific devices .
The associated micro packaging systems that will allow for the
integration of devices or circuits, made with non-compatible
technologies, with a System-on-Chip environment. The MEMS
technology can be used for permanent, semi permanent or temporary
interconnection of sub modules in a System-on-Chip implementation.
The interconnection of devices using MEMS technology is described
with the help of a hearing instrument application and related
|Description: ||Seminar report submitted in Aug 2010 in partial fulfillment of the requirements for the Degree of Bachelor of Technology (B.Tech ) in Computer Science and Engineering under the Guideship of Preetha M.S|
|Appears in Collections:||Seminar Reports|
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