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Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/2208

Authors: Arvind Kumar Jha
Keywords: micropackaging
System-on-Chip implementation
Issue Date: 9-Feb-2011
Abstract: Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices . The associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semi permanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related micropackaging.
Description: Seminar report submitted in Aug 2010 in partial fulfillment of the requirements for the Degree of Bachelor of Technology (B.Tech ) in Computer Science and Engineering under the Guideship of Preetha M.S
URI: http://hdl.handle.net/123456789/2208
Appears in Collections:Seminar Reports

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